Burn-In-Board :

• Large size board up to 24” X 24”
• Maximum Number of Layers up to 18 with PCB thickness of 0.093” to 0.125”
• Minimum Drill size 0.006”
• Maintaining Aspect Ratio below 10
• Hole density: used up to 20000 holes per board.
• Silver Epoxy filled via techniques specifically for Compression mount Sockets
• Minimum 3mils trace width
• Single ended Controlled Impedance (50 Ohm) and Differential Impedance (100 Ohm).
• High speed PCB layout Traces
• High Voltage and High current traces per IPC/JEDEC standard.

Burn-In-Board Assembly :

• Burn in boards for many different type of burn in system
• (MCC high power and current boards, Criteria V boards, ADEC style oven boards, MAX3/4 AHER boards)
• Environmental stress test boards
• (THB, HAST boards)
• Device Evaluation board Assembly (WLCSP, Ubga, QFN,…)
• Conformal coating, Under fill & Encapsulation

Burn-In-Board Test :

• Flying Probe Test (For Small and Production run)
• One Takaya 9400 series tester (For MCC board testing)
• Two Takaya 8400 series tester
• BT-600 Leakage Test (measures leakage)
• Bench Test for Signal Integrity check
• AEHR RTM test (Test device output in real time measurement (RTM). Needs active device and pattern /vector file)